Bonds structure:

Issuer

 PT. Tower Bersama Infrastructure Tbk (TBIG)

Proceeds target of Shelf Registration Bonds

Rp. 7 trillion

Second phase issuance

 Rp 628 billion

Bonds rating from PT. Fitch Ratings Indonesia

AA- (idn)

Underwriter

PT. CGS-CIMB Sekuritas Indonesia

PT. DBS Vickers Securities Indonesia

PT. Indo Premier Securities

Proceeds usage

 To be used for payment of part of liabilities to PT. Solu Sindo Kreasi Pratama ("SKP"), the Company's Subsidiary, related to the Revolving Loan Facility in US$ 200,000,000 Facility Agreement, which to be paid to creditors through United Overseas Bank Ltd. as an Agent

Schedule:

Effective Date

June 28, 2018

Public Offering Period

October 12&15, 2018

Allotment Date

October 16, 2018

Bond Distribution Date ("Emission Date")

October 18, 2018

Listing Date

October 19, 2018

TBIG - PT. Tower Bersama Infrastructure Tbk

Rp 1.870

+15 (+0,80%)