Tower Bersama Infrastructureは2018年10月12日と15日、Rp 628 billionの2018年第2相第3発行登録債券を発行
Bonds structure: | |
Issuer | PT. Tower Bersama Infrastructure Tbk (TBIG) |
Proceeds target of Shelf Registration Bonds | Rp. 7 trillion |
Second phase issuance | Rp 628 billion |
Bonds rating from PT. Fitch Ratings Indonesia | AA- (idn) |
Underwriter | PT. CGS-CIMB Sekuritas Indonesia PT. DBS Vickers Securities Indonesia PT. Indo Premier Securities |
Proceeds usage | To be used for payment of part of liabilities to PT. Solu Sindo Kreasi Pratama ("SKP"), the Company's Subsidiary, related to the Revolving Loan Facility in US$ 200,000,000 Facility Agreement, which to be paid to creditors through United Overseas Bank Ltd. as an Agent |
Schedule: | |
Effective Date | June 28, 2018 |
Public Offering Period | October 12&15, 2018 |
Allotment Date | October 16, 2018 |
Bond Distribution Date ("Emission Date") | October 18, 2018 |
Listing Date | October 19, 2018 |