TINS - PT. Timah Tbk

Rp 1.265

-30 (-2,00%)

JAKARTA - The Shelf Registration Bond IV Mandala Multifinance Tahap III Tahun 2021 Seri B from PT Mandala Multifinance Tbk (MFIN) will be the first bond on the list of bonds maturing in August. On August 6, this consumer finance company is expected to pay IDR 150 billion toward a bond debt. The Shelf Registration Bond V BFI Finance Indonesia Tahap II Tahun 2021 Seri C will also be paid off at IDR 530 billion on the same day from PT BFI Finance Indonesia Tbk (BFIN), another financing company.

Beginning in the second week of August, specifically on August 11, PT Merdeka Copper Gold Tbk (MDKA), the parent company operating in the metal ore mining sector, will be distributing fresh capital to settle the Shelf Registration Bond IV Merdeka Copper Gold Tahap III Tahun 2023 Seri A, totaling more than IDR 1.08 trillion. After three days, it is the turn of the state-owned tin mining company PT Timah Tbk (TINS) to settle the Shelf Registration Bond  II SPINDO Tahap Ii Tahun 2023 of IDR 110.35 billion and the steel pipe manufacturer PT Steel Pipe Industry of Indonesia Tbk (ISSP) to settle the Shelf Registration Bond I TIMAH Tahap II Tahun 2019 Seri B of IDR 493 billion.

Furthermore, on August 24, the construction company PT Adhi Karya (Persero) Tbk (ADHI), another state-owned enterprise, has scheduled payment of IDR 473.50 billion to the Shelf Registration Bond III Adhi Karya Tahap II Tahun 2021 Seri B. On the same day, bonds totaling IDR 2.517 trillion held by PT Bank Rakyat Indonesia (Persero) Tbk (BBRI), specifically Shelf Registration Bond II Bank BRI Tahap III Tahun 2017 Seri C, will mature. This is the biggest payment made this month towards bond debt as well. Ultimately, on August 26, it is the turn of PT Sinar Mas Multiartha Tbk (SMMA), a financial services provider, to pay investors of Shelf Registration Bond II Sinar Mas Multiartha Tahap II Tahun 2022 Seri B IDR 13.10 billion. (KD)

The latest bond call can be accessed on IDNFinancials!