JAKARTA. PT Tower Bersama Infrastructure Tbk (TBIG), a telco infrastructure company, issues Shelf-Registration Bonds VI of TBIG Phase II Year 2023 with a total principal of IDR 1.51 trillion. 

Said obligations are a part of a Public Offering VI of TBIG with a total target of raised funds of IDR 20 trillion. Previously, TBIG had also issued its first-phase bonds worth IDR 1.5 trillion.

For the second phase, the coupon attached to the bonds is 6.75% per annum, while the tenor is else to 370 days.

TBIG had secured an "idAA+ (idn)" rating from Fitch Ratings Indonesia for this upcoming obligation. The public offering is scheduled to take place on November 28-29, followed by the distribution of the bonds on December 5, 2023. The listing on Indonesia Stock Exchange (IDX) is set to December 6, 2023.

In the issued prospectus, TBIG is said to allocate approximately IDR 975 billion of the proceeds to pay off loan principal of PT Tower Bersama. Then, the remaining portion is allocated to pay loan principal of PT Solu Sindo Kreasi Pratama. (KR/ZH)