JAKARTA. PT Tower Bersama Infrastructure Tbk (TBIG), a telecommunication infrastructure service provider, will issue its Shelf-Registration Bonds VI Phase III Year 2024 with a total principal of IDR 2.7 trillion.

Said bonds are a part of Public Offering Program of Shelf-Registration Bonds VI of TBIG, with targeted funds to be raised of IDR 20 trillion. Previously, the company had issued bonds with a principal of IDR 3.01 trillion.

For this Phase III issuance, TBIG issued scripless bonds, which will be offered 100% of total principal value. The bonds are offered with a fixed annual interest rate of 6.75% and a tenor of 370 days since emission date.

In the prospectus, TBIG will allocate the proceeds of bonds’ issuance to refinance several maturing bonds this year.

TBIG has obtained an “AA+(idn)” rating for the upcoming bonds. The public offering of bonds will take place on January 31 and February 1, 2024. The distribution of the bonds will then follow on February 6, 2024, before finally being listed on Indonesia Stock Exchange (IDX) on February 7, 2024. (KR/ZH)