TBIG - PT. Tower Bersama Infrastructure Tbk

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JAKARTA. PT Tower Bersama Infrastructure Tbk (TBGI), a telecommunication infrastructure service provider, will issue Shel-Registration Bond VI Phase IV Year 2024 with total principal of IDR 2 trillion.

Said bond is a part of a more extensive Public Offering Program VI of TBIG, aiming to secure proceeds of IDR 20 trillion in total. Prior to this, TBIG had issued Bond Phase I, II, and III, with total principal worth IDR 1.5 trillion, IDR 1.51 trillion, and IDR 2.7 trillion, respectively.

For this Phase IV, TBIG is offering 2 series of bond, split into IDR 1.24 trillion through series A and IDR 756.92 billion through series B.

The coupon set for series A is 6.45% per annum (p.a.) and tenure of 370 days. Meanwhile, the coupon offered for series B is 6.75% p.a., with tenure of 3 years.

TBIG had secured an “AA(+idn)” rating from Fitch Ratings Indonesia for the upcoming bond.

The public offering of the bond will take place from November 25 to 26, 2024, followed by the electronic distribution of the bond on December 3, and listing on Indonesia Stock Exchange (IDX) on December 4, 2024. (KR/ZH)