JAKARTA - PT Tower Bersama Infrastructure Tbk (TBIG) confirmed the preparedness to pay principal and interest of Series B of Shelf-Registration Bond Year 2022 maturing next March 2, 2025.

Helmy Yusman Santoso, Director of TBIG, mentioned that the 12th round of principal and interest payment of Shelf-Registration Bond 2022 will be carried out through PT Kustodian Sentral Efek Indonesia (KSEI), as the payment agent.

“The company has prepared the budget to pay off principal and interest of bonds to bondholders,” Santoso said, quoted Friday (7/2).

TBIG had issued Series B of Shelf-Registration Bond V Phase III Year 2022 worth IDR 500 billion on March 4, 2022. The bond interest was set to 5.9% per annum, with interest payment carried out every three months. (LK/ZH)